Mohammad Eslamy

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 8,120,154
- Issue date Feb 21, 2012
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 8,106,493
- Issue date Jan 31, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 7,838,339
- Issue date Nov 23, 2010
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 7,691,670
- Issue date Apr 6, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20110024886
- Publication date Feb 3, 2011
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20100140762
- Publication date Jun 10, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...
- Publication number 20090283919
- Publication date Nov 19, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20090273065
- Publication date Nov 5, 2009
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20090250796
- Publication date Oct 8, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized hermetic sealing of a power monitor on a planar light cir...
- Publication number 20060163462
- Publication date Jul 27, 2006
- Mohammad Eslamy
- G02 - OPTICS
Information Patent Application
Localized hermetic sealing of a power monitor on a planar light cir...
- Publication number 20040183003
- Publication date Sep 23, 2004
- Mohammad Eslamy
- G02 - OPTICS

Mohammad Eslamy

Person

Patents Grantslast 30 patents

Interconnection of lead frame to die utilizing flip chip process

Semiconductor device package having features formed by stamping

Semiconductor device package having features formed by stamping

Interconnection of lead frame to die utilizing flip chip process

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

Localized hermetic sealing of a power monitor on a planar light cir...

Localized hermetic sealing of a power monitor on a planar light cir...