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Mohammad M. Farahani
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic assembly including built-in thermoelectric cooler a...
Patent number
8,686,277
Issue date
Apr 1, 2014
Intel Corporation
Mohammad M. Farahani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress sensor for in-situ measurement of package-induced stress in...
Patent number
8,586,393
Issue date
Nov 19, 2013
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Grant
Stress sensor for in-situ measurement of package-induced stress in...
Patent number
8,174,084
Issue date
May 8, 2012
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Grant
Elimination of voids at the oxide/silicon interface in trench-based...
Patent number
6,472,270
Issue date
Oct 29, 2002
Advanced Micro Devices, Inc.
Franklin D. Crawford
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Microelectronic Assembly including Built-In Thermoelectric Cooler a...
Publication number
20150332987
Publication date
Nov 19, 2015
Intel Corporation
Mohammad M. Farahani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFLECTION SENSOR FOR IN-SITU DEFLECTION MEASUREMENT IN SEMICONDUCT...
Publication number
20140013855
Publication date
Jan 16, 2014
Mohammad M. FARAHANI
G01 - MEASURING TESTING
Information
Patent Application
STRESS SENSOR FOR IN-SITU MEASUREMENT OF PACKAGE-INDUCED STRESS IN...
Publication number
20120193734
Publication date
Aug 2, 2012
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Application
Stress sensor for in-situ measurement of package-induced stress in...
Publication number
20080067619
Publication date
Mar 20, 2008
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Application
Offset solder bump method and apparatus
Publication number
20060264021
Publication date
Nov 23, 2006
Intel Corporation
Mohammad M. Farahani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic assembly including built-in thermoelectric cooler a...
Publication number
20060137732
Publication date
Jun 29, 2006
Mohammad M. Farahani
H01 - BASIC ELECTRIC ELEMENTS