Mohammad Massoodi

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Performing passive voltage contrast on a silicon on insulator semic...
- Patent number 6,960,802
- Issue date Nov 1, 2005
- Advanced Micro Devices, Inc.
- Mehrad Mahanpour
- G01 - MEASURING TESTING
Information Patent Grant
Detecting heat generating failures in unpassivated semiconductor de...
- Patent number 6,866,416
- Issue date Mar 15, 2005
- Advanced Micro Devices, Inc.
- Mehrdad Mahanpour
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for removing conductive lines during deprocessing
- Patent number 6,768,198
- Issue date Jul 27, 2004
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for reducing polymer build up during plasma etch...
- Patent number 6,528,332
- Issue date Mar 4, 2003
- Advanced Micro Devices, Inc.
- Mehrdad Mahanpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic decapsulation system utilizing an integrated spacer/prote...
- Patent number 6,517,666
- Issue date Feb 11, 2003
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Automatic decapsulation system utilizing an acid resistant, high he...
- Patent number 6,409,878
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Xia Li
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for visual inspection during device analysis
- Patent number 6,399,958
- Issue date Jun 4, 2002
- Advanced Micro Devices, Inc.
- Mohammad Massoodi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decapsulation techniques for multi-chip (MCP) devices
- Patent number 6,358,852
- Issue date Mar 19, 2002
- Advanced Micro Devices, Inc.
- Susan Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for selectively disconnecting a redundant power d...
- Patent number 6,320,400
- Issue date Nov 20, 2001
- Advanced Micro Devices, Inc.
- J. Courtney Black
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for detecting faults utilizing an AC power supply
- Patent number 6,294,923
- Issue date Sep 25, 2001
- Advanced Micro Devices, Inc.
- Richard C. Blish
- G01 - MEASURING TESTING
Information Patent Grant
Package removal for FBGA devices
- Patent number 6,127,194
- Issue date Oct 3, 2000
- Advanced Micro Devices, Inc.
- Mehrdad Mahanpour
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method and system for reducing polymer build up during plasma etch...
- Publication number 20020158247
- Publication date Oct 31, 2002
- Mehrdad Mahanpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Automatic decapsulation system utilizing an integrated spacer/prote...
- Publication number 20020139768
- Publication date Oct 3, 2002
- Xia Li
- G01 - MEASURING TESTING
Information Patent Application
Method and system for decapsulating a multi-chip package
- Publication number 20020089066
- Publication date Jul 11, 2002
- Mohammad Massoodi
- H01 - BASIC ELECTRIC ELEMENTS

Mohammad Massoodi

Person

Patents Grantslast 30 patents

Performing passive voltage contrast on a silicon on insulator semic...

Detecting heat generating failures in unpassivated semiconductor de...

Method and system for removing conductive lines during deprocessing

Method and system for reducing polymer build up during plasma etch...

Automatic decapsulation system utilizing an integrated spacer/prote...

Automatic decapsulation system utilizing an acid resistant, high he...

Apparatus for visual inspection during device analysis

Decapsulation techniques for multi-chip (MCP) devices

Method and system for selectively disconnecting a redundant power d...

Method and system for detecting faults utilizing an AC power supply

Package removal for FBGA devices

Patents Applicationslast 30 patents

Method and system for reducing polymer build up during plasma etch...

Automatic decapsulation system utilizing an integrated spacer/prote...

Method and system for decapsulating a multi-chip package