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Mohammad Waseem Hussain

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  • Irving, TX, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-CHIP MODULE LEADLESS PACKAGE
    • Publication number 20250022781
    • Publication date Jan 16, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew David Romig
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP MODULE LEADLESS PACKAGE
    • Publication number 20230129232
    • Publication date Apr 27, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew David Romig
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERDIGITATED OUTWARD AND INWARD BENT LEADS FOR PACKAGED ELECTRONI...
    • Publication number 20220384317
    • Publication date Dec 1, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohammad Waseem Hussain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADLESS LEADFRAME AND SEMICONDUCTOR DEVICE PACKAGE THEREFROM
    • Publication number 20220139847
    • Publication date May 5, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohammad Waseem Hussain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP MODULE LEADLESS PACKAGE
    • Publication number 20210257282
    • Publication date Aug 19, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew David Romig
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Die Attachment
    • Publication number 20200219798
    • Publication date Jul 9, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohammad Waseem Hussain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layer Die Attachment
    • Publication number 20190259685
    • Publication date Aug 22, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohammad Waseem Hussain
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR