Mohammadali Khorrami

Person

Foxboro, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally-conductive electromagnetic interference (EMI) absorbers p...
- Patent number 10,477,739
- Issue date Nov 12, 2019
- Laird Technologies, Inc.
- Paul Francis Dixon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board level shields with virtual grounding capability
- Patent number 10,455,688
- Issue date Oct 22, 2019
- Laird Technologies, Inc.
- Mohammadali Khorrami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft and/or flexible EMI shields and related methods
- Patent number 10,278,314
- Issue date Apr 30, 2019
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Absorber assemblies having a dielectric spacer, and corresponding m...
- Patent number 10,212,806
- Issue date Feb 19, 2019
- Laird Technologies, Inc.
- Paul Francis Dixon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board level shields with virtual grounding capability
- Patent number 9,999,121
- Issue date Jun 12, 2018
- Laird Technologies, Inc.
- Mohammadali Khorrami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials including electrically-conductive material
- Patent number 9,968,004
- Issue date May 8, 2018
- Laird Technologies, Inc.
- Mohammadali Khorrami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Board Level Shields With Virtual Grounding Capability
- Publication number 20180295714
- Publication date Oct 11, 2018
- Laird Technologies, Inc.
- Mohammadali KHORRAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally-Conductive Electromagnetic Interference (EMI) Absorbers P...
- Publication number 20180228063
- Publication date Aug 9, 2018
- Laird Technologies, Inc.
- Paul Francis Dixon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER ASSEMBLIES HAVING A DIELECTRIC SPACER, AND CORRESPONDING M...
- Publication number 20180199429
- Publication date Jul 12, 2018
- Laird Technologies, Inc.
- Paul Francis Dixon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
- Publication number 20180168076
- Publication date Jun 14, 2018
- Laird Technologies, Inc.
- Kuo Chun Chao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
- Publication number 20180139872
- Publication date May 17, 2018
- Laird Technologies, Inc.
- John Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIALS INCLUDING ELECTRICALLY-CODUCTIVE MATERIAL
- Publication number 20170094831
- Publication date Mar 30, 2017
- Laird Technologies, Inc.
- Mohammadali Khorrami
- H01 - BASIC ELECTRIC ELEMENTS

Mohammadali Khorrami

Person

Patents Grantslast 30 patents

Thermally-conductive electromagnetic interference (EMI) absorbers p...

Board level shields with virtual grounding capability

Soft and/or flexible EMI shields and related methods

Absorber assemblies having a dielectric spacer, and corresponding m...

Board level shields with virtual grounding capability

Thermal interface materials including electrically-conductive material

Patents Applicationslast 30 patents

Board Level Shields With Virtual Grounding Capability

Thermally-Conductive Electromagnetic Interference (EMI) Absorbers P...

ABSORBER ASSEMBLIES HAVING A DIELECTRIC SPACER, AND CORRESPONDING M...

STRETCHABLE AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS

SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS

THERMAL INTERFACE MATERIALS INCLUDING ELECTRICALLY-CODUCTIVE MATERIAL