Mohan Prashanth Javare Gowda

Person

Ottobrunn, DE

People

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299014
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299012
- Publication date Sep 21, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299013
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
- Publication number 20230268286
- Publication date Aug 24, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...
- Publication number 20230268291
- Publication date Aug 24, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Mohan Prashanth Javare Gowda

Person

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBS...