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Mohan R. Nagar
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Cupertino, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Ground lid opening on a substrate
Patent number
9,320,183
Issue date
Apr 19, 2016
Cisco Technology, Inc.
Mohan R. Nagar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for supporting a computer chip on a printed ci...
Patent number
8,962,388
Issue date
Feb 24, 2015
Cisco Technology, Inc.
Mohan R. Nagar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package lid configured for package coplanarity
Patent number
8,952,523
Issue date
Feb 10, 2015
Cisco Technology, Inc.
Mudasir Ahmad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lid for an electrical hardware component
Patent number
8,736,044
Issue date
May 27, 2014
Cisco Technology, Inc.
Mudasir Ahmad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for supporting a computer chip on a printed ci...
Patent number
8,081,484
Issue date
Dec 20, 2011
Cisco Technology, Inc.
Mohan R. Nagar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
COUPLING OF AN INTERPOSER TO A PACKAGE SUBSTRATE
Publication number
20160064320
Publication date
Mar 3, 2016
Cisco Technology, Inc.
Li Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...
Publication number
20150173177
Publication date
Jun 18, 2015
Cisco Technology, Inc.
Mohan R. Nagar
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEM IN PACKAGE MODULE ASSEMBLY
Publication number
20130284796
Publication date
Oct 31, 2013
Cisco Technology, Inc.
Mohan R. Nagar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...
Publication number
20120113608
Publication date
May 10, 2012
Cisco Technology, Inc.
Mohan R. Nagar
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Integrated Circuit Package Lid Configured For Package Coplanarity
Publication number
20120074557
Publication date
Mar 29, 2012
Cisco Technology, Inc.
Mudasir Ahmad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LID FOR AN ELECTRICAL HARDWARE COMPONENT
Publication number
20120018872
Publication date
Jan 26, 2012
Mudasir Ahmad
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and apparatus for supporting a computer chip on a printed ci...
Publication number
20080130241
Publication date
Jun 5, 2008
Cisco Technology, Inc.
Mohan R. Nagar
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...