Mohanraj Prabhugoud

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compression mounted technology (CMT) socket system retention mechan...
- Patent number 12,176,643
- Issue date Dec 24, 2024
- Intel Corporation
- Thomas Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micro-coaxial wire interconnect architecture
- Patent number 11,656,247
- Issue date May 23, 2023
- Intel Corporation
- Ronald Michael Kirby
- G01 - MEASURING TESTING
Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable, high load, low stiffness, and small footprint loading mec...
- Patent number 11,449,111
- Issue date Sep 20, 2022
- Intel Corporation
- Eric W. Buddrius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielded interconnect array
- Patent number 10,644,458
- Issue date May 5, 2020
- Intel Corporation
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Grant
Movable heatsink utilizing flexible heat pipes
- Patent number 10,595,439
- Issue date Mar 17, 2020
- Intel Corporation
- David Shia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package testing system and method with contact alignment
- Patent number 10,324,112
- Issue date Jun 18, 2019
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ISOLATORS FOR MULTI-CHANNEL OPTICAL INTERCONNECTS
- Publication number 20250004205
- Publication date Jan 2, 2025
- Intel Corporation
- Dekang CHEN
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20250004225
- Publication date Jan 2, 2025
- Intel Corporation
- Mohanraj Prabhugoud
- G02 - OPTICS
Information Patent Application
MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...
- Publication number 20240133945
- Publication date Apr 25, 2024
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR
- Publication number 20240094476
- Publication date Mar 21, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES
- Publication number 20240027697
- Publication date Jan 25, 2024
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
BACKSIDE INTEGRATED TORSION LOADING MECHANISM
- Publication number 20230395460
- Publication date Dec 7, 2023
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...
- Publication number 20220102887
- Publication date Mar 31, 2022
- Intel Corporation
- Feifei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET SYSTEM RETENTION MECHAN...
- Publication number 20220102889
- Publication date Mar 31, 2022
- Intel Corporation
- Thomas BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE WITH PROTECTIVE MATERIAL TO PREVENT REACTION WITH LIQUID...
- Publication number 20210410328
- Publication date Dec 30, 2021
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR RECONFIGURABLE HEAT SINKS
- Publication number 20210345519
- Publication date Nov 4, 2021
- Intel Corporation
- Wenbin Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS
- Publication number 20210327787
- Publication date Oct 21, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PHASE MANIFOLD COLD PLATE FOR LIQUID COOLING
- Publication number 20210219459
- Publication date Jul 15, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LIQUID COOLING INTERFACES
- Publication number 20210216121
- Publication date Jul 15, 2021
- Intel Corporation
- Kristin L. Weldon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
- Publication number 20210183737
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY
- Publication number 20210183846
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20210105911
- Publication date Apr 8, 2021
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES
- Publication number 20200227362
- Publication date Jul 16, 2020
- Intel Corporation
- Jonathan W. THIBADO
- G02 - OPTICS
Information Patent Application
REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS
- Publication number 20200205299
- Publication date Jun 25, 2020
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICRO-COAXIAL WIRE INTERCONNECT ARCHITECTURE
- Publication number 20200141979
- Publication date May 7, 2020
- Intel Corporation
- Ronald Michael Kirby
- G01 - MEASURING TESTING
Information Patent Application
SCALABLE, HIGH LOAD, LOW STIFFNESS, AND SMALL FOOTPRINT LOADING MEC...
- Publication number 20190302857
- Publication date Oct 3, 2019
- Intel Corporation
- Eric W. Buddrius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOVABLE HEATSINK UTILIZING FLEXIBLE HEAT PIPES
- Publication number 20190045663
- Publication date Feb 7, 2019
- Intel Corporation
- David Shia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PACKAGE TESTING SYSTEM AND METHOD WITH CONTACT ALIGNMENT
- Publication number 20180045759
- Publication date Feb 15, 2018
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR
- Publication number 20160178663
- Publication date Jun 23, 2016
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING

Mohanraj Prabhugoud

Person

Patents Grantslast 30 patents

Compression mounted technology (CMT) socket system retention mechan...

Cold plate architecture for liquid cooling of devices

Compression mounted technology (CMT) socket retention mechanisms to...

Reflow grid array to support late attach of components

Micro-coaxial wire interconnect architecture

Interposer and electronic package

Scalable, high load, low stiffness, and small footprint loading mec...

Shielded interconnect array

Movable heatsink utilizing flexible heat pipes

Package testing system and method with contact alignment

Patents Applicationslast 30 patents

OPTICAL ISOLATORS FOR MULTI-CHANNEL OPTICAL INTERCONNECTS

TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR

MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...

TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR

PLUGGABLE OPTICAL CONNECTOR WITH INTERFACIAL ALIGNMENT FEATURES

BACKSIDE INTEGRATED TORSION LOADING MECHANISM

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET SYSTEM RETENTION MECHAN...

COLD PLATE WITH PROTECTIVE MATERIAL TO PREVENT REACTION WITH LIQUID...

TECHNOLOGIES FOR RECONFIGURABLE HEAT SINKS

BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS

TWO-PHASE MANIFOLD COLD PLATE FOR LIQUID COOLING

TECHNOLOGIES FOR LIQUID COOLING INTERFACES

LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP

ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES

REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS

MICRO-COAXIAL WIRE INTERCONNECT ARCHITECTURE

SCALABLE, HIGH LOAD, LOW STIFFNESS, AND SMALL FOOTPRINT LOADING MEC...

MOVABLE HEATSINK UTILIZING FLEXIBLE HEAT PIPES

PACKAGE TESTING SYSTEM AND METHOD WITH CONTACT ALIGNMENT

FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR