Mohd Afiz Hashim

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Shah Alam, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with wire bond joints
- Patent number 12,205,874
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints and related methods of...
- Patent number 11,842,953
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS
- Publication number 20240105564
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF...
- Publication number 20220352056
- Publication date Nov 3, 2022
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS