Mohd Hasrul Bin ZULKIFLI

Person

Selangor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal clip with a solder volume balan...
- Patent number 11,769,748
- Issue date Sep 26, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,764,135
- Issue date Sep 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor assembly and method for fabric...
- Patent number 11,676,881
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal clip with solder volume balancing reservoir
- Patent number 11,545,459
- Issue date Jan 3, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,355,424
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,896,869
- Issue date Jan 19, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device using ganged cond...
- Patent number 10,833,008
- Issue date Nov 10, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device using ganged cond...
- Patent number 10,121,742
- Issue date Nov 6, 2018
- Amkor Technology, Inc.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...
- Publication number 20230094794
- Publication date Mar 30, 2023
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR
- Publication number 20220238475
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Level Interconnect Clip
- Publication number 20220139811
- Publication date May 5, 2022
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package
- Publication number 20210074614
- Publication date Mar 11, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20210074616
- Publication date Mar 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...
- Publication number 20210020539
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...
- Publication number 20210013142
- Publication date Jan 14, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20190221506
- Publication date Jul 18, 2019
- Amkor Technology, Inc.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...
- Publication number 20180350735
- Publication date Dec 6, 2018
- Amkor Technology, Inc.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...
- Publication number 20180269147
- Publication date Sep 20, 2018
- Amkor Technology, Inc.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Mohd Hasrul Bin ZULKIFLI

Person

Patents Grantslast 30 patents

Three level interconnect clip

Semiconductor device having a metal clip with a solder volume balan...

Method of manufacturing a semiconductor device

Semiconductor package, semiconductor assembly and method for fabric...

Metal clip with solder volume balancing reservoir

Multi-chip package

Method of manufacturing a semiconductor device

Method of forming a packaged semiconductor device using ganged cond...

Method of forming a packaged semiconductor device using ganged cond...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A METAL CLIP WITH A SOLDER VOLUME BALAN...

METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR

Three Level Interconnect Clip

Multi-Chip Package

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED COND...