Mohd Helmy Bin Ahmad

Follow

Person

Johor Bahru, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system including ribbon bond interconnect
- Patent number 7,443,018
- Issue date Oct 28, 2008
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS