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Mohd Kahar Bajuri
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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package with wire bond joints and related methods of...
Patent number
11,842,953
Issue date
Dec 12, 2023
Infineon Technologies AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer interconnection ribbon
Patent number
11,705,387
Issue date
Jul 18, 2023
Infineon Technologies AG
Emil Lamco Jocson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clips for semiconductor packages
Patent number
11,211,353
Issue date
Dec 28, 2021
Infineon Technologies AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with heat slug and rivet free die attach area
Patent number
10,083,899
Issue date
Sep 25, 2018
Infineon Technologies AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS
Publication number
20240105564
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF...
Publication number
20220352056
Publication date
Nov 3, 2022
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layer Interconnection Ribbon
Publication number
20220068770
Publication date
Mar 3, 2022
Emil Lamco Jocson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
Publication number
20210013171
Publication date
Jan 14, 2021
INFINEON TECHNOLOGIES AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT SLUG AND RIVET FREE DIE ATTACH AREA
Publication number
20180211907
Publication date
Jul 26, 2018
INFINEON TECHNOLOGIES AG
Mohd Kahar Bajuri
H01 - BASIC ELECTRIC ELEMENTS