Mohd Kamran Akhtar

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having features with a fin portion of diffe...
- Patent number 11,877,434
- Issue date Jan 16, 2024
- Micron Technology, Inc.
- Yan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,631,684
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and semiconductor memory devices
- Patent number 11,594,536
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Yong Mo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated memory with redistribution of capacitor connections, and...
- Patent number 11,563,008
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including stair step structures adjacent substantially plan...
- Patent number 11,508,742
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having dielectric regions along conductive st...
- Patent number 11,239,242
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device
- Patent number 11,239,240
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Arzum F. Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with doped surfaces, and related methods with in situ doping
- Patent number 11,088,147
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Jaydip Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,998,326
- Issue date May 4, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,734,395
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices, and related semiconductor...
- Patent number 10,707,215
- Issue date Jul 7, 2020
- Micron Technology, Inc.
- Arzum F. Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having dielectric regions along conductive st...
- Patent number 10,700,073
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation material for a pillar adjacent a trench
- Patent number 10,665,665
- Issue date May 26, 2020
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,483,270
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies having dielectric regions...
- Patent number 10,347,643
- Issue date Jul 9, 2019
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,229,923
- Issue date Mar 12, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,984,977
- Issue date May 29, 2018
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 9,853,037
- Issue date Dec 26, 2017
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,679,852
- Issue date Jun 13, 2017
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PARAMETER PLASMA ASHING TECHNIQUES
- Publication number 20240355595
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Rachmat Wibowo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING A STAIR STEP STRUCTURE ADJACENT A SUBSTANTIALLY P...
- Publication number 20230077163
- Publication date Mar 9, 2023
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Semiconductor Memory Devices
- Publication number 20220293598
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Yong Mo Yang
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Memory with Redistribution of Capacitor Connections, and...
- Publication number 20220285357
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...
- Publication number 20220013527
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Yan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210233922
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH DOPED SURFACES, AND RELATED METHODS WITH IN SITU DOPING
- Publication number 20200411529
- Publication date Dec 31, 2020
- Micron Technology, Inc.
- Jaydip Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20200321347
- Publication date Oct 8, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20200312857
- Publication date Oct 1, 2020
- Micron Technology, Inc.
- Arzum F. Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Dielectric Regions Along Conductive St...
- Publication number 20200286898
- Publication date Sep 10, 2020
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A TRENCH USING A POLYMERIZING RADICAL MATERIAL
- Publication number 20200243537
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Yan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION MATERIAL FOR A PILLAR ADJACENT A TRENCH
- Publication number 20200127080
- Publication date Apr 23, 2020
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING STAIR STEP STRUCTURES
- Publication number 20200118919
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES, AND RELATED SEMICONDUCTOR...
- Publication number 20200066729
- Publication date Feb 27, 2020
- Micron Technology, Inc.
- Arzum F. Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20200058663
- Publication date Feb 20, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Dielectric Regions Along Conductive St...
- Publication number 20190378843
- Publication date Dec 12, 2019
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20190206883
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A STA...
- Publication number 20180082940
- Publication date Mar 22, 2018
- Micron Technology, Inc.
- Troy R. Sorensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20180076209
- Publication date Mar 15, 2018
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20170263563
- Publication date Sep 14, 2017
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20170148802
- Publication date May 25, 2017
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20160005693
- Publication date Jan 7, 2016
- Micron Technology, Inc.
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS

Mohd Kamran Akhtar

Person

Patents Grantslast 30 patents

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices having features with a fin portion of diffe...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and semiconductor memory devices

Integrated memory with redistribution of capacitor connections, and...

Devices including stair step structures adjacent substantially plan...

Integrated assemblies having dielectric regions along conductive st...

Methods of forming a semiconductor device

Apparatus with doped surfaces, and related methods with in situ doping

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Methods of forming semiconductor devices, and related semiconductor...

Integrated assemblies having dielectric regions along conductive st...

Passivation material for a pillar adjacent a trench

Integrated assemblies and methods of forming integrated assemblies

Methods of forming integrated assemblies having dielectric regions...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor constructions

Integrated assemblies

Semiconductor constructions

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

LOW PARAMETER PLASMA ASHING TECHNIQUES

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

DEVICES INCLUDING A STAIR STEP STRUCTURE ADJACENT A SUBSTANTIALLY P...

Integrated Assemblies and Semiconductor Memory Devices

Integrated Memory with Redistribution of Capacitor Connections, and...

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...

Integrated Assemblies and Methods of Forming Integrated Assemblies

APPARATUS WITH DOPED SURFACES, AND RELATED METHODS WITH IN SITU DOPING

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF FORMING A SEMICONDUCTOR DEVICE

Integrated Assemblies Having Dielectric Regions Along Conductive St...

FORMATION OF A TRENCH USING A POLYMERIZING RADICAL MATERIAL

PASSIVATION MATERIAL FOR A PILLAR ADJACENT A TRENCH

DEVICES INCLUDING STAIR STEP STRUCTURES

METHODS OF FORMING SEMICONDUCTOR DEVICES, AND RELATED SEMICONDUCTOR...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Dielectric Regions Along Conductive St...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A STA...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Semiconductor Constructions

Integrated Assemblies and Methods of Forming Integrated Assemblies

Semiconductor Constructions