Mohit Sood

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
- Publication number 20180324955
- Publication date Nov 8, 2018
- Intel Corporation
- Mohit SOOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY (BGA) APPARATUS AND METHODS
- Publication number 20170066088
- Publication date Mar 9, 2017
- Intel Corporation
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20160181222
- Publication date Jun 23, 2016
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR