Mohsen Haji-Rahim

Person

Chapel Hill, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated module with electromagnetic shielding
- Patent number 11,784,136
- Issue date Oct 10, 2023
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated module with electromagnetic shielding
- Patent number 11,139,250
- Issue date Oct 5, 2021
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated module with electromagnetic shielding
- Patent number 10,410,972
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic modules having grounded electromagnetic shields
- Patent number 9,807,890
- Issue date Oct 31, 2017
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module having a first die with a power amplifier...
- Patent number 9,583,471
- Issue date Feb 28, 2017
- Qorvo US, Inc.
- Douglas Andrew Teeter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an electronic module
- Patent number 8,959,757
- Issue date Feb 24, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly with improved interconnect
- Patent number 7,732,253
- Issue date Jun 8, 2010
- RF Micro Devices, Inc.
- T. Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING
- Publication number 20250070042
- Publication date Feb 27, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20210398914
- Publication date Dec 23, 2021
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20190371740
- Publication date Dec 5, 2019
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20180240759
- Publication date Aug 23, 2018
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER...
- Publication number 20150200189
- Publication date Jul 16, 2015
- RF Micro Devices, Inc.
- Douglas Andrew Teeter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20150036306
- Publication date Feb 5, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS
- Publication number 20140355222
- Publication date Dec 4, 2014
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20130170147
- Publication date Jul 4, 2013
- RF Micro Devices, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS

Mohsen Haji-Rahim

Person

Patents Grantslast 30 patents

Integrated module with electromagnetic shielding

Integrated module with electromagnetic shielding

Integrated module with electromagnetic shielding

Redistribution layer system in package

Electronic modules having grounded electromagnetic shields

Integrated circuit module having a first die with a power amplifier...

Method of manufacturing an electronic module

Flip-chip assembly with improved interconnect

Patents Applicationslast 30 patents

MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING

INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING

INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING

INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING

INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER...

RDL SYSTEM IN PACKAGE

ELECTRONIC MODULES HAVING GROUNDED ELECTROMAGNETIC SHIELDS

RDL SYSTEM IN PACKAGE