Mon-Chin Tsai

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device with embedded passive component by flip-c...
- Patent number 7,670,876
- Issue date Mar 2, 2010
- Advanced Semiconductor Engineering, Inc.
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with embedded passive component by flip-c...
- Patent number 7,391,118
- Issue date Jun 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit device with embedded passive component by flip-c...
- Publication number 20080233676
- Publication date Sep 25, 2008
- Advanced Semiconductor Engineering, Inc.
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
- Publication number 20060199306
- Publication date Sep 7, 2006
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND WAFER STRUCTURE
- Publication number 20060197191
- Publication date Sep 7, 2006
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer structure, chip structure, and fabricating process thereof
- Publication number 20060134884
- Publication date Jun 22, 2006
- Advanced Semiconductor Engineering, Inc.
- Jian Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for wire-bonding and flip-chip bonding package...
- Publication number 20050181538
- Publication date Aug 18, 2005
- Advanced Semiconductor Engineering, Inc.
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device with embedded passive component by flip-c...
- Publication number 20050046041
- Publication date Mar 3, 2005
- Advanced Semiconductor Engineering, Inc.
- Mon-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS