Monsen Liu

Person

Zhudong Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding low-k materials in antennas
- Patent number 11,984,668
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using integrated transmitter and receiver front end module
- Patent number 11,764,823
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- En-Hsiang Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna apparatus and method
- Patent number 11,532,868
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices, packaged semiconductor...
- Patent number 11,289,449
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Encapsulating low-k dielectric blocks along with dies in an encapsu...
- Patent number 11,050,153
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices, packaged semiconductor...
- Patent number 10,872,878
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company
- Chuei-Tang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of using integrated transmitter and receiver front end module
- Patent number 10,804,953
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- En-Hsiang Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna apparatus and method
- Patent number 10,622,701
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transmitter and receiver front end module, transceiver,...
- Patent number 10,461,799
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- En-Hsiang Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device including integrated fan out antenna and metho...
- Patent number 10,297,925
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D shielding case and methods for forming the same
- Patent number 10,276,401
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding low-k materials in antennas
- Patent number 10,270,172
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 9,985,336
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy harvesting device
- Patent number 9,859,778
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- En-Hsiang Yeh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated fan out antenna and method of forming the same
- Patent number 9,843,106
- Issue date Dec 12, 2017
- TAIWAN SEMICONDCUTOR MANUFACTURING COMPANY, LTD.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a tunable three dimensional inductor
- Patent number 9,767,957
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pop structures and methods of forming the same
- Patent number 9,490,167
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufactoring Company, Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming package-on-packages
- Patent number 9,478,474
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 9,431,369
- Issue date Aug 30, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy harvesting device
- Patent number 9,407,184
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- En-Hsiang Yeh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power supply arrangement for semiconductor device
- Patent number 9,406,648
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices, packaged semiconductor...
- Patent number 9,396,300
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RF choke device for integrated circuits
- Patent number 9,391,350
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Jeng-Shien Hsieh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
3D shielding case and methods for forming the same
- Patent number 9,337,073
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Embedding low-k materials in antennas
- Patent number 9,252,491
- Issue date Feb 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
POP structures and methods of forming the same
- Patent number 8,975,726
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURE FOR MULT-CHIP INTERPOSER AND METHOD OF MA...
- Publication number 20250087589
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chou-Kun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087588
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS INCLUDING LINE-ON-VIA AND LINE-IN-VIA INTERCONNECT STRU...
- Publication number 20250038093
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...
- Publication number 20230402438
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS
- Publication number 20230395481
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE
- Publication number 20230387961
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- En-Hsiang YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230154892
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT I...
- Publication number 20230137691
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Ying LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT A...
- Publication number 20230063304
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...
- Publication number 20220415813
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER VIA INTERCONNECT SHAPES WITH IMPROVED PERFORMANCE CHARAC...
- Publication number 20220406723
- Publication date Dec 22, 2022
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Low-K Materials in Antennas
- Publication number 20210328347
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE
- Publication number 20210028811
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- En-Hsiang YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Antenna Apparatus and Method
- Publication number 20200220250
- Publication date Jul 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE
- Publication number 20200067560
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- En-Hsiang YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Packaging Methods for Semiconductor Devices, Packaged Semiconductor...
- Publication number 20200020666
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedding Low-K Materials in Antennas
- Publication number 20190252783
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20180241114
- Publication date Aug 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE THREE DIMENSIONAL INDUCTOR
- Publication number 20180108477
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Monsen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTEGRATED FAN OUT ANTENNA AND METHO...
- Publication number 20180102595
- Publication date Apr 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20160359221
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lai Wei Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVESTING DEVICE
- Publication number 20160308429
- Publication date Oct 20, 2016
- EN-HSIANG YEH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Packaging Methods for Semiconductor Devices, Packaged Semiconductor...
- Publication number 20160293576
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Shielding Case and Methods for Forming the Same
- Publication number 20160254168
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Low-K Materials in Antennas
- Publication number 20160126634
- Publication date May 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN OUT ANTENNA AND METHOD OF FORMING THE SAME
- Publication number 20160104940
- Publication date Apr 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY ARRANGEMENT FOR SEMICONDUCTOR DEVICE
- Publication number 20160093588
- Publication date Mar 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods for Semiconductor Devices, Packaged Semiconductor...
- Publication number 20150200182
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POP Structures and Methods of Forming the Same
- Publication number 20150155203
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device having an integrated device positioned within...

Method of embedding low-k materials in antennas

Method of using integrated transmitter and receiver front end module

Antenna apparatus and method

Packaging methods for semiconductor devices, packaged semiconductor...

Encapsulating low-k dielectric blocks along with dies in an encapsu...

Packaging methods for semiconductor devices, packaged semiconductor...

Method of using integrated transmitter and receiver front end module

Antenna apparatus and method

Integrated transmitter and receiver front end module, transceiver,...

Semiconductor device including integrated fan out antenna and metho...

3D shielding case and methods for forming the same

Embedding low-k materials in antennas

Antenna apparatus and method

Energy harvesting device

Integrated fan out antenna and method of forming the same

Method of manufacturing a tunable three dimensional inductor

Pop structures and methods of forming the same

Methods and apparatus for forming package-on-packages

Antenna apparatus and method

Energy harvesting device

Power supply arrangement for semiconductor device

Packaging methods for semiconductor devices, packaged semiconductor...

RF choke device for integrated circuits

3D shielding case and methods for forming the same

Embedding low-k materials in antennas

POP structures and methods of forming the same

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURE FOR MULT-CHIP INTERPOSER AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

INTERPOSERS INCLUDING LINE-ON-VIA AND LINE-IN-VIA INTERCONNECT STRU...

Hybrid organic and non-organic interposer with embedded component a...

DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...

REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS

METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT I...

HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT A...

INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...

INTERPOSER VIA INTERCONNECT SHAPES WITH IMPROVED PERFORMANCE CHARAC...

Embedding Low-K Materials in Antennas

METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE

Antenna Apparatus and Method

METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE

Packaging Methods for Semiconductor Devices, Packaged Semiconductor...

Embedding Low-K Materials in Antennas

Antenna Apparatus and Method

TUNABLE THREE DIMENSIONAL INDUCTOR

SEMICONDUCTOR DEVICE INCLUDING INTEGRATED FAN OUT ANTENNA AND METHO...

Antenna Apparatus and Method

ENERGY HARVESTING DEVICE

Packaging Methods for Semiconductor Devices, Packaged Semiconductor...

3D Shielding Case and Methods for Forming the Same

Embedding Low-K Materials in Antennas

INTEGRATED FAN OUT ANTENNA AND METHOD OF FORMING THE SAME

POWER SUPPLY ARRANGEMENT FOR SEMICONDUCTOR DEVICE

Packaging Methods for Semiconductor Devices, Packaged Semiconductor...

POP Structures and Methods of Forming the Same