Mooi Ling Chang

Person

Kedah, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die stacks with stacked capacitors and methods of assembli...
- Patent number 11,121,074
- Issue date Sep 14, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact semiconductor chip system and method
- Patent number 11,096,284
- Issue date Aug 17, 2021
- Intel Corporation
- Wee Hoe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Over-molded IC package with in-mold capacitor
- Patent number 10,998,261
- Issue date May 4, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die stacks with stacked capacitors and methods of assembli...
- Patent number 10,593,618
- Issue date Mar 17, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-molded IC packages with embedded voltage reference plane and h...
- Patent number 10,541,200
- Issue date Jan 21, 2020
- Intel Corporation
- Ping Ping Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 10,515,912
- Issue date Dec 24, 2019
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-component substrate for a microelectronic device
- Patent number 10,297,541
- Issue date May 21, 2019
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding thin film resistors in substrates in power delivery networks
- Patent number 8,228,680
- Issue date Jul 24, 2012
- Intel Corporation
- Myitzu Soe Myat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
- Publication number 20230091395
- Publication date Mar 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
- Publication number 20220174820
- Publication date Jun 2, 2022
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLI...
- Publication number 20210005547
- Publication date Jan 7, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT SEMICONDUCTOR CHIP SYSTEM AND METHOD
- Publication number 20200107444
- Publication date Apr 2, 2020
- Intel Corporation
- Wee Hoe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
- Publication number 20190208643
- Publication date Jul 4, 2019
- Intel Corporation
- Tin Poay CHUAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20190096833
- Publication date Mar 28, 2019
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLI...
- Publication number 20190006277
- Publication date Jan 3, 2019
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER-MOLDED IC PACKAGES WITH EMBEDDED VOLTAGE REFERENCE PLANE & HEA...
- Publication number 20180366407
- Publication date Dec 20, 2018
- Intel Corporation
- Ping Ping OOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER-MOLDED IC PACKAGE WITH IN-MOLD CAPACITOR
- Publication number 20180358292
- Publication date Dec 13, 2018
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-COMPONENT SUBSTRATE FOR A MICROELECTRONIC DEVICE
- Publication number 20180145016
- Publication date May 24, 2018
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Thin Film Resistors in Substrates in Power Delivery Networks
- Publication number 20100134992
- Publication date Jun 3, 2010
- Myitzu Soe Myat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding thin film resistors in substrates in power delivery networks
- Publication number 20060291174
- Publication date Dec 28, 2006
- Myitzu Soe Myat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mooi Ling Chang

Person

Patents Grantslast 30 patents

Vertical embedded component in a printed circuit board blind hole

Packaged die stacks with stacked capacitors and methods of assembli...

Compact semiconductor chip system and method

Over-molded IC package with in-mold capacitor

Packaged die stacks with stacked capacitors and methods of assembli...

Over-molded IC packages with embedded voltage reference plane and h...

Integrated circuit packages

Multiple-component substrate for a microelectronic device

Embedding thin film resistors in substrates in power delivery networks

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES

CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS

PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLI...

COMPACT SEMICONDUCTOR CHIP SYSTEM AND METHOD

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

INTEGRATED CIRCUIT PACKAGES

PACKAGED DIE STACKS WITH STACKED CAPACITORS AND METHODS OF ASSEMBLI...

OVER-MOLDED IC PACKAGES WITH EMBEDDED VOLTAGE REFERENCE PLANE & HEA...

OVER-MOLDED IC PACKAGE WITH IN-MOLD CAPACITOR

MULTIPLE-COMPONENT SUBSTRATE FOR A MICROELECTRONIC DEVICE

Embedding Thin Film Resistors in Substrates in Power Delivery Networks

Embedding thin film resistors in substrates in power delivery networks