Moon Bong Ahn

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Sungnam, KR

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Patents Grantslast 30 patents

Information Patent Grant
Chip package assembly having chip package mounted on printed circui...
- Patent number 6,774,492
- Issue date Aug 10, 2004
- Samsung Electro-Mechanics Co., Ltd.
- Moon Bong Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 6,653,725
- Issue date Nov 25, 2003
- Samsung Electro-Mechanics Co., Ltd.
- Moon Bong Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor laser diode having a PCB type lead frame
- Publication number 20050063434
- Publication date Mar 24, 2005
- Chan Wang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode forming method in circuit device and chip package and mul...
- Publication number 20040009629
- Publication date Jan 15, 2004
- Samsung Electro-Mechanics CO., LTD.
- Moon Bong Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip package and method of manufacturing the same
- Publication number 20030122230
- Publication date Jul 3, 2003
- Samsung Electro-Mechanics CO., LTD.
- Moon Bong Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and method of manufacturing the same
- Publication number 20030122231
- Publication date Jul 3, 2003
- Samsung Electro-Mechanics CO., LTD.
- Moon Bong Ahn
- H01 - BASIC ELECTRIC ELEMENTS