Moon-gi CHO

Person

Gunpo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having multi-level metallization structures
- Patent number 10,930,648
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having insulating metal oxide layer covering...
- Patent number 10,770,384
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Soo-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,636,785
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Hwichan Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,453,838
- Issue date Oct 22, 2019
- Samsung Electronics Co., Ltd.
- Hwichan Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,347,627
- Issue date Jul 9, 2019
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 10,211,089
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fuse pattern
- Patent number 9,449,918
- Issue date Sep 20, 2016
- Samsung Electronics Co., Ltd.
- Moon-Gi Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump structures having an extension
- Patent number 9,312,213
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fuse pattern
- Patent number 9,123,725
- Issue date Sep 1, 2015
- Samsung Electronics Co., Ltd.
- Moon-Gi Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder collapse free bumping process of semiconductor device
- Patent number 8,980,739
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Moon-gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing the same
- Patent number 8,928,150
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Moon-Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, having concave lateral sides, semiconductor package...
- Patent number 8,922,008
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- Jong-Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and semiconductor package including a solder...
- Patent number 8,710,657
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Jeong-woo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20210167063
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190287965
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190252372
- Publication date Aug 15, 2019
- Samsung Electronics Co., Ltd.
- Hwichan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20180366463
- Publication date Dec 20, 2018
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20180247887
- Publication date Aug 30, 2018
- Samsung Electronics Co., Ltd.
- Soo-jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180130796
- Publication date May 10, 2018
- Samsung Electronics Co., Ltd.
- Hwichan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20180082890
- Publication date Mar 22, 2018
- Samsung Electronics Co., Ltd.
- Moon Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20160329275
- Publication date Nov 10, 2016
- Samsung Electronics Co., Ltd.
- Soojae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD
- Publication number 20150364387
- Publication date Dec 17, 2015
- Moon-gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING FUSE PATTERN
- Publication number 20150325518
- Publication date Nov 12, 2015
- Samsung Electronics Co., Ltd.
- Moon-Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...
- Publication number 20140377909
- Publication date Dec 25, 2014
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING FUSE PATTERN
- Publication number 20140151845
- Publication date Jun 5, 2014
- Moon-Gi CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...
- Publication number 20140084457
- Publication date Mar 27, 2014
- Moon Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140015145
- Publication date Jan 16, 2014
- Samsung Electronics Co., Ltd.
- Moon-Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AN...
- Publication number 20130292822
- Publication date Nov 7, 2013
- Samsung Electronics Co., Ltd.
- Jong-Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130256876
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Ui-hyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE
- Publication number 20130082090
- Publication date Apr 4, 2013
- Samsung Electronics Co., Ltd.
- Moon-gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER COLLAPSE FREE BUMPING PROCESS OF SEMICONDUCTOR DEVICE
- Publication number 20120295434
- Publication date Nov 22, 2012
- Samsung Electronics Co., Ltd.
- Moon-gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...
- Publication number 20120129333
- Publication date May 24, 2012
- Samsung Electronics Co., Ltd.
- Ha-Young YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER...
- Publication number 20120086123
- Publication date Apr 12, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- JEONG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS

Moon-gi CHO

Person

Patents Grantslast 30 patents

Semiconductor devices having multi-level metallization structures

Printed circuit board having insulating metal oxide layer covering...

Semiconductor device

Semiconductor device

Semiconductor devices

Semiconductor device and method of fabricating the same

Semiconductor device having fuse pattern

Bump structures having an extension

Semiconductor packages having through electrodes and methods for fa...

Semiconductor device having fuse pattern

Solder collapse free bumping process of semiconductor device

Multi-chip package and method of manufacturing the same

Bump structure, having concave lateral sides, semiconductor package...

Semiconductor assembly and semiconductor package including a solder...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES

PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME

WAFER POLISHING METHOD

SEMICONDUCTOR DEVICE HAVING FUSE PATTERN

SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...

SEMICONDUCTOR DEVICE HAVING FUSE PATTERN

BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AN...

SEMICONDUCTOR PACKAGE

METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

SOLDER COLLAPSE FREE BUMPING PROCESS OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...

SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER...