MoonKi Jeong

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Icheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,432,028
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20120241936
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS