Moosung M. CHAE

Person

Englewood Cliffs, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical fuse formation during a multiple patterning process
- Patent number 11,348,870
- Issue date May 31, 2022
- GLOBALFOUNDRIES U.S. INC.
- Jiehui Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse formation during a multiple patterning process
- Patent number 10,784,195
- Issue date Sep 22, 2020
- GLOBALFOUNDRIES Inc.
- Jiehui Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with interface liner and methods of forming same
- Patent number 10,553,478
- Issue date Feb 4, 2020
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with interface liner and methods of forming same
- Patent number 10,079,208
- Issue date Sep 18, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgaps to isolate metallization features
- Patent number 10,043,753
- Issue date Aug 7, 2018
- GLOBALFOUNDRIES Inc.
- Huy Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of self-forming barrier formation in metal interconnection...
- Patent number 9,905,460
- Issue date Feb 27, 2018
- GLOBALFOUNDRIES Inc.
- Moosung M. Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration enhancing method for self-forming barrier process...
- Patent number 9,666,524
- Issue date May 30, 2017
- GLOBALFOUNDRIES Inc.
- Moosung Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having non-magnetic single core inductor and m...
- Patent number 9,484,297
- Issue date Nov 1, 2016
- GLOBALFOUNDRIES Inc.
- Ki Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including selectively deposited metal capping l...
- Patent number 9,484,252
- Issue date Nov 1, 2016
- GLOBALFOUNDRIES, INC.
- Moosung Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration enhancing method for self-forming barrier process...
- Patent number 9,362,228
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Moosung Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manganese and manganese nitride barriers for back-end-of-lin...
- Patent number 9,159,610
- Issue date Oct 13, 2015
- GLOBALFOUNDIRES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integration of pore stuffing material
- Patent number 9,054,052
- Issue date Jun 9, 2015
- Global Foundries Inc.
- Nicholas Vincent Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of self-forming barrier integration with pore stuffed ULK m...
- Patent number 8,932,934
- Issue date Jan 13, 2015
- Global Foundries Inc.
- Moosung M. Chae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL FUSE FORMATION DURING A MULTIPLE PATTERNING PROCESS
- Publication number 20200335435
- Publication date Oct 22, 2020
- GLOBALFOUNDRIES INC.
- Jiehui Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE FORMATION DURING A MULTIPLE PATTERNING PROCESS
- Publication number 20190326209
- Publication date Oct 24, 2019
- GLOBALFOUNDRIES INC.
- Jiehui Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME
- Publication number 20180337126
- Publication date Nov 22, 2018
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAPS TO ISOLATE METALLIZATION FEATURES
- Publication number 20180166383
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Huy CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME
- Publication number 20180033728
- Publication date Feb 1, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELF-FORMING BARRIER FORMATION IN METAL INTERCONNECTION...
- Publication number 20170133325
- Publication date May 11, 2017
- GLOBALFOUNDRIES INC.
- Moosung M. CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING NON-MAGNETIC SINGLE CORE INDUCTOR AND M...
- Publication number 20160268195
- Publication date Sep 15, 2016
- GLOBALFOUNDRIES INC.
- Ki Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION ENHANCING METHOD FOR SELF-FORMING BARRIER PROCESS...
- Publication number 20160225712
- Publication date Aug 4, 2016
- GLOBALFOUNDRIES INC.
- Moosung CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH A COPPER AND MANGANESE COMPONENT AND METHO...
- Publication number 20150255331
- Publication date Sep 10, 2015
- GLOBALFOUNDRIES, Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING SELECTIVELY DEPOSITED METAL CAPPING L...
- Publication number 20150194344
- Publication date Jul 9, 2015
- GLOBAL FOUNDRIES, INC.
- Moosung Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF FORMING BARRIER LAYER AND METHOD OF FORMING
- Publication number 20150137372
- Publication date May 21, 2015
- GLOBALFOUNDRIES INC.
- Moosung M. CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION ENHANCING METHOD FOR SELF-FORMING BARRIER PROCESS...
- Publication number 20150108646
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES INC.
- Moosung CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANGANESE AND MANGANESE NITRIDE BARRIERS FOR BACK-END-OF-LIN...
- Publication number 20150108647
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES, Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID
- Publication number 20140353805
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Errol Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL
- Publication number 20140353802
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Nicholas Vincent LICAUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...
- Publication number 20140353835
- Publication date Dec 4, 2014
- Moosung M. CHAE
- H01 - BASIC ELECTRIC ELEMENTS

Moosung M. CHAE

Person

Patents Grantslast 30 patents

Electrical fuse formation during a multiple patterning process

Electrical fuse formation during a multiple patterning process

IC structure with interface liner and methods of forming same

IC structure with interface liner and methods of forming same

Airgaps to isolate metallization features

Methods of self-forming barrier formation in metal interconnection...

Electro-migration enhancing method for self-forming barrier process...

Semiconductor device having non-magnetic single core inductor and m...

Integrated circuits including selectively deposited metal capping l...

Electro-migration enhancing method for self-forming barrier process...

Hybrid manganese and manganese nitride barriers for back-end-of-lin...

Methods for integration of pore stuffing material

Methods of self-forming barrier integration with pore stuffed ULK m...

Patents Applicationslast 30 patents

ELECTRICAL FUSE FORMATION DURING A MULTIPLE PATTERNING PROCESS

ELECTRICAL FUSE FORMATION DURING A MULTIPLE PATTERNING PROCESS

IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME

AIRGAPS TO ISOLATE METALLIZATION FEATURES

IC STRUCTURE WITH INTERFACE LINER AND METHODS OF FORMING SAME

METHODS OF SELF-FORMING BARRIER FORMATION IN METAL INTERCONNECTION...

SEMICONDUCTOR DEVICE HAVING NON-MAGNETIC SINGLE CORE INDUCTOR AND M...

ELECTRO-MIGRATION ENHANCING METHOD FOR SELF-FORMING BARRIER PROCESS...

INTEGRATED CIRCUITS WITH A COPPER AND MANGANESE COMPONENT AND METHO...

INTEGRATED CIRCUITS INCLUDING SELECTIVELY DEPOSITED METAL CAPPING L...

SELF FORMING BARRIER LAYER AND METHOD OF FORMING

ELECTRO-MIGRATION ENHANCING METHOD FOR SELF-FORMING BARRIER PROCESS...

HYBRID MANGANESE AND MANGANESE NITRIDE BARRIERS FOR BACK-END-OF-LIN...

METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID

METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL

METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...