Morgan Lee Upshall

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Oshawa, CA

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonder for ball bonding insulated wire and method of using same
- Patent number 7,360,675
- Issue date Apr 22, 2008
- Microbonds, Inc.
- John I. Persic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH PERFORMANCE IC PACKAGE AND METHOD
- Publication number 20080048344
- Publication date Feb 28, 2008
- Robert Lyn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance IC package and method
- Publication number 20060175712
- Publication date Aug 10, 2006
- Microbonds, Inc.
- Robert Lyn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonder for ball bonding insulated wire and method of using same
- Publication number 20050139637
- Publication date Jun 30, 2005
- John I. Persic
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR