Morihiko Ikemizu

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,840,166
- Issue date Nov 17, 2020
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pointed bumps
- Patent number 6,495,922
- Issue date Dec 17, 2002
- Kabushiki Kaisha Toshiba
- Tetsuya Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
- Patent number 6,326,243
- Issue date Dec 4, 2001
- Kabushiki Kaisha Toshiba
- Nobuhito Suzuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor package
- Patent number 6,097,085
- Issue date Aug 1, 2000
- Kabushiki Kaisha Toshiba
- Morihiko Ikemizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab tape and semiconductor device using the tab tape
- Patent number 5,892,277
- Issue date Apr 6, 1999
- Kabushiki Kaisha Toshiba
- Morihiko Ikemizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
- Patent number 5,753,969
- Issue date May 19, 1998
- Kabushiki Kaisha Toshiba
- Nobuhito Suzuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TCP type semiconductor device capable of preventing crosstalk
- Patent number 5,659,198
- Issue date Aug 19, 1997
- Kabushiki Kaisha Toshiba
- Takayuki Okutomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a thin semiconductor package having many pi...
- Patent number 5,652,184
- Issue date Jul 29, 1997
- Kabushiki Kaisha Toshiba
- Masao Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device wherein a semicondu...
- Patent number 5,612,259
- Issue date Mar 18, 1997
- Kabushiki Kaisha Toshiba
- Takayuki Okutomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package having many pins and likely to dissipate...
- Patent number 5,442,232
- Issue date Aug 15, 1995
- Kabushiki Kaisha Toshiba
- Masao Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TCP type semiconductor device capable of preventing crosstalk
- Patent number 5,359,222
- Issue date Oct 25, 1994
- Kabushiki Kaisha Toshiba
- Takayuki Okutomo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295923
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kumiko Karouji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of making the same
- Publication number 20020011677
- Publication date Jan 31, 2002
- Kabushiki Kaisha Toshiba
- Tetsuya Yokoi
- H01 - BASIC ELECTRIC ELEMENTS

Morihiko Ikemizu

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device with pointed bumps

Resin sealed semiconductor device including a die pad uniformly hav...

Electronic device and semiconductor package

Tab tape and semiconductor device using the tab tape

Resin sealed semiconductor device including a die pad uniformly hav...

TCP type semiconductor device capable of preventing crosstalk

Method of manufacturing a thin semiconductor package having many pi...

Method for manufacturing a semiconductor device wherein a semicondu...

Thin semiconductor package having many pins and likely to dissipate...

TCP type semiconductor device capable of preventing crosstalk

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor device and method of making the same