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Morikuni Hasebe
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Kamakura, JP
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last 30 patents
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Patent Grant
Semiconductor wafer-securing adhesive tape
Patent number
5,538,771
Issue date
Jul 23, 1996
Furukawa Electric Co., Ltd.
Koji Nakayama
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Patent Grant
Polyethylene base resin composition having highly filled with an in...
Patent number
4,353,817
Issue date
Oct 12, 1982
The Furukawa Electric Co., Ltd.
Hiroyuki Nakae
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...