Morimasa Tanimoto

Follow

Person

Nikko, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number RE38588
- Issue date Sep 14, 2004
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Plated material, method of producing same, and electrical/electroni...
- Patent number 6,770,383
- Issue date Aug 3, 2004
- The Furukawa Electric Co., Ltd.
- Hitoshi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lead member with multiple conductive layers and specific grain size
- Patent number 6,140,583
- Issue date Oct 31, 2000
- The Fururakawa Electric Co., Ltd.
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number 6,110,608
- Issue date Aug 29, 2000
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Reflow-plated member and a manufacturing method therefor
- Patent number 5,614,328
- Issue date Mar 25, 1997
- The Furukawa Electric Co. Ltd.
- Satoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Plated material, method of producing same, and electrical/electroni...
- Publication number 20030091855
- Publication date May 15, 2003
- Hitoshi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...