Morimichi Umino

Person

Hitachiota, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 8,420,210
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 7,273,900
- Issue date Sep 25, 2007
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal stable low elastic modulus material and device using the same
- Patent number 6,638,631
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yuichi Satsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal stable low elastic modulus material and device using the same
- Patent number 6,638,352
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yuichi Satsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Superconducting magnet superconducting magnet coil, and manufacturi...
- Patent number 5,606,300
- Issue date Feb 25, 1997
- Hitachi, Ltd.
- Toru Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded part and method of making the same
- Patent number 4,728,557
- Issue date Mar 1, 1988
- Hitachi, Ltd.
- Hideki Asano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD...
- Publication number 20070292668
- Publication date Dec 20, 2007
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition, prepreg, laminate sheet and printed wiring board...
- Publication number 20050064159
- Publication date Mar 24, 2005
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal stable low elastic modulus material and device using the same
- Publication number 20030047351
- Publication date Mar 13, 2003
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal stable low elastic modulus material and device using the same
- Publication number 20030049193
- Publication date Mar 13, 2003
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS

Morimichi Umino

Person

Patents Grantslast 30 patents

Resin composition, prepreg, laminate sheet and printed wiring board...

Resin composition, prepreg, laminate sheet and printed wiring board...

Thermal stable low elastic modulus material and device using the same

Thermal stable low elastic modulus material and device using the same

Superconducting magnet superconducting magnet coil, and manufacturi...

Molded part and method of making the same

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD...

Resin composition, prepreg, laminate sheet and printed wiring board...

Thermal stable low elastic modulus material and device using the same

Thermal stable low elastic modulus material and device using the same