Morio Nakao

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Shinjuku-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board having a solder pad and a method for manufactu...
- Patent number 7,568,922
- Issue date Aug 4, 2009
- Ibiden Co., Ltd.
- Takahiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting base board having heat slug with slit...
- Patent number 6,232,558
- Issue date May 15, 2001
- Ibiden Co., Ltd.
- Kiyotaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting base board and method of producing th...
- Patent number 5,914,859
- Issue date Jun 22, 1999
- Ibiden Co., Ltd.
- Masaru Takada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Printed wiring board
- Publication number 20060169484
- Publication date Aug 3, 2006
- IBIDEN CO., LTD.
- Takahiro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR