Morito KANADA

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Resin package and light emitting device
- Patent number 9,698,312
- Issue date Jul 4, 2017
- Nichia Corporation
- Ryosuke Wakaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN PACKAGE AND LIGHT EMITTING DEVICE
- Publication number 20150171282
- Publication date Jun 18, 2015
- Nichia Corporation.
- Ryosuke WAKAKI
- H01 - BASIC ELECTRIC ELEMENTS