Moritz Haupt

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an integrated circuit including a transistor
- Patent number 7,718,475
- Issue date May 18, 2010
- Qimonda AG
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for a semiconductor structure
- Patent number 7,265,023
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void free, silicon filled trenches in semiconductors
- Patent number 7,157,327
- Issue date Jan 2, 2007
- Infineon Technologies AG
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a transistor
- Publication number 20080251815
- Publication date Oct 16, 2008
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor with hemispherical silicon-germanium grains and a method...
- Publication number 20080067568
- Publication date Mar 20, 2008
- Qimonda AG
- Saad Abbasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void free, silicon filled trenches in semiconductors
- Publication number 20060003523
- Publication date Jan 5, 2006
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-filling for isolation
- Publication number 20060003546
- Publication date Jan 5, 2006
- Andreas Klipp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for a semiconductor structure
- Publication number 20050245042
- Publication date Nov 3, 2005
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for N+ doping of amorphous silicon and polysilicon electrode...
- Publication number 20050164469
- Publication date Jul 28, 2005
- Infineon Technologies North America Corp.
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS