Moriyuki Kashiwa

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Annaka-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate planarization apparatus and planarization m...
- Patent number 8,366,514
- Issue date Feb 5, 2013
- Okamoto Machine Tool Works, Ltd.
- Satoru Ide
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate flat grinding device
- Patent number 8,047,897
- Issue date Nov 1, 2011
- Okamoto Machine Tool Works, Ltd.
- Moriyuki Kashiwa
- B24 - GRINDING POLISHING
Information Patent Grant
Planarizing device and a planarization method for semiconductor sub...
- Patent number 7,238,087
- Issue date Jul 3, 2007
- Okamoto Machine Tool Works, Ltd.
- Moriyuki Kashiwa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE PLANARIZATION APPARATUS AND PLANARIZATION M...
- Publication number 20110165823
- Publication date Jul 7, 2011
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Satoru IDE
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE FLAT GRINDING DEVICE
- Publication number 20090203299
- Publication date Aug 13, 2009
- OKAMOTO MACHINE TOOL WORKS LTD.
- Moriyuki KASHIWA
- B24 - GRINDING POLISHING