Motoharu Yamada

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Hiratsuka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Polishing method for semiconductor wafer
- Patent number 7,303,691
- Issue date Dec 4, 2007
- Sumco Techxiv Corporation
- Kazuaki Kozasa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Polishing method for semiconductor wafer
- Publication number 20070059935
- Publication date Mar 15, 2007
- KOMATSU ELECTRONIC METALS CO., LTD.
- Kazuaki Kozasa
- B24 - GRINDING POLISHING