TREA

Motohide Takeichi

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Patents Grantslast 30 patents

  • Information Patent Grant

    COG-assembly and connecting material to be used therein
    • Patent number 6,903,463
    • Issue date Jun 7, 2005
    • Sony Chemicals Corporation
    • Motohide Takeichi
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Thermosetting adhesive material
    • Patent number 6,673,858
    • Issue date Jan 6, 2004
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Adhesives and electric devices
    • Patent number 6,641,928
    • Issue date Nov 4, 2003
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Adhesive material and circuit connection method
    • Patent number 6,632,320
    • Issue date Oct 14, 2003
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connection material
    • Patent number 6,611,065
    • Issue date Aug 26, 2003
    • Sony Chemicals Corporation
    • Motohide Takeichi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Connecting material
    • Patent number 6,566,422
    • Issue date May 20, 2003
    • Sony Chemicals Corporation
    • Hidekazu Yagi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for mounting electronic elements
    • Patent number 6,531,026
    • Issue date Mar 11, 2003
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connecting material
    • Patent number 6,514,433
    • Issue date Feb 4, 2003
    • Sony Chemicals Corporation
    • Motohide Takeichi
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Connecting material and connection structure
    • Patent number 6,475,641
    • Issue date Nov 5, 2002
    • Sony Chemicals Corp.
    • Junji Shinozaki
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Connecting material for anisotropically electroconductive connection
    • Patent number 6,451,875
    • Issue date Sep 17, 2002
    • Sony Chemicals Corporation
    • Yasuhiro Suga
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Anisotropically electroconductive adhesive material and connecting...
    • Patent number 6,426,021
    • Issue date Jul 30, 2002
    • Sony Chemicals Corp.
    • Yasuhiro Suga
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Packaging method
    • Patent number 6,349,872
    • Issue date Feb 26, 2002
    • Sony Chemicals Corp.
    • Yukio Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multilayer anisotropic electroconductive adhesive and method for ma...
    • Patent number 6,020,059
    • Issue date Feb 1, 2000
    • Sony Chemicals Corporation
    • Yukio Yamada
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Anisotropically electroconductive adhesive and adhesive film
    • Patent number 5,965,064
    • Issue date Oct 12, 1999
    • Sony Chemicals Corporation
    • Yukio Yamada
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Battery and protecting element therefor
    • Patent number 5,939,217
    • Issue date Aug 17, 1999
    • Sony Chemicals Corporation
    • Hisaya Tamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Protective device
    • Patent number 5,712,610
    • Issue date Jan 27, 1998
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Adhesive material and circuit connection method
    • Publication number 20040029992
    • Publication date Feb 12, 2004
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Connection material
    • Publication number 20020098319
    • Publication date Jul 25, 2002
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Adhesives and electric devices
    • Publication number 20020062918
    • Publication date May 30, 2002
    • Sony Chemicals Corp.
    • Motohide Takeichi
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Connecting material and connection structure
    • Publication number 20020009597
    • Publication date Jan 24, 2002
    • SONY CHEMICALS CORP.
    • Junji Shinozaki
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Anisotropically electroconductive adhesive material and connecting...
    • Publication number 20010026866
    • Publication date Oct 4, 2001
    • Sony Chemicals Corp.
    • Yasuhiro Suga
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Thermosetting adhesive material
    • Publication number 20010020697
    • Publication date Sep 13, 2001
    • SONY CHEMICAL CORP.
    • Motohide Takeichi
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...