Motohiko Kato

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding method and apparatus

    • Patent number 6,449,516
    • Issue date Sep 10, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bump forming method

    • Patent number 5,981,371
    • Issue date Nov 9, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Apparatus for connecting external leads

    • Patent number 4,887,758
    • Issue date Dec 19, 1989
    • Kabushiki Kaisha Shinkawa
    • Yasunobu Suzuki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Automatic focus adjusting device

    • Patent number 4,156,563
    • Issue date May 29, 1979
    • Nihon Beru-Haueru Kabuskiki Kaisha
    • Motohiko Kato
    • G02 - OPTICS