Motoi Nezu

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of grinding back surface of semiconductor wafer and semicond...
- Patent number 7,601,615
- Issue date Oct 13, 2009
- Tokyo Seimitsu Co., Ltd.
- Tomoo Hayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for peeling surface protective film
- Patent number 7,521,384
- Issue date Apr 21, 2009
- Tokyo Seimitsu Co., Ltd.
- Masaki Kanazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Method of grinding back surface of semiconductor wafer and semicond...
- Publication number 20070105343
- Publication date May 10, 2007
- Tomoo Hayashi
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for peeling surface protective film
- Publication number 20070087475
- Publication date Apr 19, 2007
- Masaki Kanazawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL