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Motoki ETO

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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,721,660
    • Issue date Aug 8, 2023
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ag alloy bonding wire for semiconductor device
    • Patent number 11,612,966
    • Issue date Mar 28, 2023
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 11,373,934
    • Issue date Jun 28, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,950,571
    • Issue date Mar 16, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,121,758
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,032,741
    • Issue date Jul 24, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,887,172
    • Issue date Feb 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240110262
    • Publication date Apr 4, 2024
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240105668
    • Publication date Mar 28, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240071978
    • Publication date Feb 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuya SUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230215834
    • Publication date Jul 6, 2023
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR D...
    • Publication number 20230154884
    • Publication date May 18, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230142531
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230146315
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230148306
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Motoki ETO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230018430
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL WIRING MATERIAL
    • Publication number 20220341004
    • Publication date Oct 27, 2022
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • C21 - METALLURGY OF IRON
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20220266396
    • Publication date Aug 25, 2022
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20220152749
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE
    • Publication number 20220157766
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200373226
    • Publication date Nov 26, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20200312808
    • Publication date Oct 1, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20190326246
    • Publication date Oct 24, 2019
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180122765
    • Publication date May 3, 2018
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170323864
    • Publication date Nov 9, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170194280
    • Publication date Jul 6, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS