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Motoki NAKAZAWA
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
Patent number
9,978,713
Issue date
May 22, 2018
Shinkawa Ltd.
Naoki Sekine
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
Patent number
9,793,236
Issue date
Oct 17, 2017
Shinkawa Ltd.
Naoki Sekine
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire-bonding apparatus and method of wire bonding
Patent number
9,457,421
Issue date
Oct 4, 2016
Shinkawa Ltd.
Naoki Sekine
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
9,379,086
Issue date
Jun 28, 2016
Shinkawa Ltd.
Shinji Kumamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
Patent number
9,368,471
Issue date
Jun 14, 2016
Shinkawa Ltd.
Shinichi Akiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding apparatus and bonding method
Patent number
9,337,166
Issue date
May 10, 2016
Shinkawa Ltd.
Yoshihito Hagiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die pick-up apparatus and method of picking up semico...
Patent number
9,028,649
Issue date
May 12, 2015
Shinkawa Ltd.
Motoki Nakazawa
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
Publication number
20160351535
Publication date
Dec 1, 2016
SHINKAWA LTD.
Naoki SEKINE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
Publication number
20160163673
Publication date
Jun 9, 2016
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20160035695
Publication date
Feb 4, 2016
SHINKAWA LTD.
SHINJI KUMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE-BONDING APPARATUS AND METHOD OF WIRE BONDING
Publication number
20150246411
Publication date
Sep 3, 2015
SHINKAWA LTD.
NAOKI SEKINE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20150249063
Publication date
Sep 3, 2015
SHINKAWA LTD.
NAOKI SEKINE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20150243627
Publication date
Aug 27, 2015
SHINKAWA LTD.
Shinichi AKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
Publication number
20140138426
Publication date
May 22, 2014
SHINKAWA LTD.
Yoshihito HAGIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PICK-UP APPARATUS AND METHOD OF PICKING UP SEMICO...
Publication number
20130272837
Publication date
Oct 17, 2013
Motoki Nakazawa
H01 - BASIC ELECTRIC ELEMENTS