Motoko Kimura

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 7,401,393
- Issue date Jul 22, 2008
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 6,739,045
- Issue date May 25, 2004
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20040206805
- Publication date Oct 21, 2004
- Hitachi, Ltd
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20030034380
- Publication date Feb 20, 2003
- Hitachi, Ltd
- Motoko Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC