Motomi Kitano

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Patents Grantslast 30 patents

Information Patent Grant
Wafer producing apparatus
- Patent number 10,916,460
- Issue date Feb 9, 2021
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer grinding apparatus
- Patent number 6,159,071
- Issue date Dec 12, 2000
- Disco Corporation
- Yutaka Koma
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER PRODUCING APPARATUS
- Publication number 20190006212
- Publication date Jan 3, 2019
- Disco Corporation
- Kentaro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS