Motoo Asai

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 9,060,446
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 8,987,603
- Issue date Mar 24, 2015
- Ibiden Co,. Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,842,440
- Issue date Sep 23, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 8,830,691
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,830
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,828
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed circuit board
- Patent number 8,782,882
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,780,573
- Issue date Jul 15, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,763,241
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed circuit board
- Patent number 8,745,863
- Issue date Jun 10, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,717,772
- Issue date May 6, 2014
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,533,943
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board for mounting electronic parts
- Patent number RE44251
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Motoo Asai
- 174 - Electricity: conductors and insulators
Information Patent Grant
Printed circuit board
- Patent number 8,331,102
- Issue date Dec 11, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,288,664
- Issue date Oct 16, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,288,665
- Issue date Oct 16, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,283,573
- Issue date Oct 9, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,249,402
- Issue date Aug 21, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,238,700
- Issue date Aug 7, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number RE43509
- Issue date Jul 17, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- 174 - Electricity: conductors and insulators
Information Patent Grant
Substrate for mounting IC chip, manufacturing method of substrate f...
- Patent number 8,120,040
- Issue date Feb 21, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with filled viahole structure
- Patent number 8,115,111
- Issue date Feb 14, 2012
- Ibiden Co., Ltd.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,116,091
- Issue date Feb 14, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,107,253
- Issue date Jan 31, 2012
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,093,507
- Issue date Jan 10, 2012
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for mounting IC chip
- Patent number 8,076,782
- Issue date Dec 13, 2011
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,030,577
- Issue date Oct 4, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,020,291
- Issue date Sep 20, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interlayer insulating layer for printed wiring board, printed wirin...
- Patent number 8,021,748
- Issue date Sep 20, 2011
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,018,045
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150250056
- Publication date Sep 3, 2015
- IIBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247572
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20130286615
- Publication date Oct 31, 2013
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130107482
- Publication date May 2, 2013
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20120186867
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
- Publication number 20120103680
- Publication date May 3, 2012
- IBIDEN CO., LTD.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20120006469
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110252641
- Publication date Oct 20, 2011
- IBIDEN, CO., LTD.
- Motoo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110253306
- Publication date Oct 20, 2011
- IBIDEN, CO., LTD.
- Motoo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110192637
- Publication date Aug 11, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110036626
- Publication date Feb 17, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110024164
- Publication date Feb 3, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100328915
- Publication date Dec 30, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND...
- Publication number 20100303406
- Publication date Dec 2, 2010
- IBIDEN CO., LTD.
- Hiroaki Kodama
- G02 - OPTICS
Information Patent Application
SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE F...
- Publication number 20100232744
- Publication date Sep 16, 2010
- IBIDEN CO., LTD.
- Motoo ASAI
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100226108
- Publication date Sep 9, 2010
- IBIDEN, CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20100195954
- Publication date Aug 5, 2010
- IBIDEN CO., LTD.
- Motoo ASAI
- G02 - OPTICS
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD
- Publication number 20100163288
- Publication date Jul 1, 2010
- IBIDEN CO., LTD.
- Hui ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20100135611
- Publication date Jun 3, 2010
- IBIDEN CO., LTD.
- Motoo ASAI
- G02 - OPTICS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20100122840
- Publication date May 20, 2010
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100118502
- Publication date May 13, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE
- Publication number 20100101852
- Publication date Apr 29, 2010
- IBIDEN CO., LTD.
- Seiji Shirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20100014261
- Publication date Jan 21, 2010
- IBIDEN CO., LTD.
- Yasushi Inagaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090205857
- Publication date Aug 20, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090188708
- Publication date Jul 30, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090183904
- Publication date Jul 23, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090090003
- Publication date Apr 9, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN...
- Publication number 20090025216
- Publication date Jan 29, 2009
- IBIDEN CO., LTD.
- Yasuji Hiramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090016671
- Publication date Jan 15, 2009
- IBIDEN CO., LTD.
- Motoo ASAI
- G02 - OPTICS
Information Patent Application
OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND...
- Publication number 20080310793
- Publication date Dec 18, 2008
- IBIDEN CO., LTD.
- Hiroaki Kodama
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Printed circuit board

Multilayer printed wiring board with filled viahole structure

Printed circuit board and method of manufacturing printed circuit b...

Printed circuit board and method of manufacturing printed circuit b...

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Method of manufacturing multi-layer printed circuit board

Printed circuit board

Method of manufacturing printed wiring board

Method of manufacturing multi-layer printed circuit board

Printed circuit board

Printed wiring board and method for producing the same

Circuit board for mounting electronic parts

Printed circuit board

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Multilayer printed circuit board

Multilayer printed circuit board

Printed wiring board and method for manufacturing the same

Substrate for mounting IC chip, manufacturing method of substrate f...

Multilayer printed wiring board with filled viahole structure

Printed circuit board

Printed circuit board

Printed wiring board and method for producing the same

Substrate for mounting IC chip

Printed wiring board and method for producing the same

Method of manufacturing a printed wiring board

Interlayer insulating layer for printed wiring board, printed wirin...

Printed circuit board

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND...

SUBSTRATE FOR MOUNTING IC CHIP, MANUFACTURING METHOD OF SUBSTRATE F...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

MULTILAYER PRINTED CIRCUIT BOARD

MULTILAYERED PRINTED CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

PRINTED CIRCUIT BOARD

MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN...

MULTILAYER PRINTED CIRCUIT BOARD

OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND...