Motoshi SAWADA

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Toyama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device by forming a film on a...
- Patent number 10,032,626
- Issue date Jul 24, 2018
- Hitachi Kokusai Electric Inc.
- Takaaki Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 9,869,022
- Issue date Jan 16, 2018
- Hitachi Kokusai Electric, Inc.
- Motoshi Sawada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 9,816,183
- Issue date Nov 14, 2017
- Hitachi Kokusai Electric Inc.
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20170287696
- Publication date Oct 5, 2017
- Hitachi Kokusai Electric Inc.
- Takaaki NODA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20170076964
- Publication date Mar 16, 2017
- Hitachi Kokusai Electric Inc.
- Motoshi SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20170067157
- Publication date Mar 9, 2017
- Hitachi Kokusai Electric Inc.
- Hiroshi ASHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20160002787
- Publication date Jan 7, 2016
- Hitachi Kokusai Electric Inc.
- Motoshi SAWADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...