Motoyo Wajima

Person

Hadano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer wiring structure
- Patent number 5,768,108
- Issue date Jun 16, 1998
- Hitachi, Ltd.
- Osamu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method and apparatus for making same
- Patent number 5,472,563
- Issue date Dec 5, 1995
- Hitachi, Ltd.
- Kiyonori Kogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic optical fibers from polymers derived from metallic salts of...
- Patent number 5,113,477
- Issue date May 12, 1992
- Hitachi, Ltd.
- Shuji Eguchi
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Process for producing printed circuit board
- Patent number 5,028,513
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and process for producing the same
- Patent number 5,021,296
- Issue date Jun 4, 1991
- Hitachi, Ltd.
- Yoshihiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin and prepreg and laminate using the same
- Patent number 4,933,228
- Issue date Jun 12, 1990
- Hitachi, Ltd.
- Junichi Katagiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin and prepreg and laminate using the same
- Patent number 4,886,858
- Issue date Dec 12, 1989
- Hitachi, Ltd.
- Junichi Katagiri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo-curable resist resin composition for electroless plating, pro...
- Patent number 4,820,549
- Issue date Apr 11, 1989
- Hitachi, Ltd.
- Kiyoshi Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and laminate and process for the pr...
- Patent number 4,784,917
- Issue date Nov 15, 1988
- Hitachi, Ltd.
- Keiko Tawara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and prepolymer obtained therefrom
- Patent number 4,752,641
- Issue date Jun 21, 1988
- Hitachi, Ltd.
- Toru Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermo-setting, polymerizable composition and wiring board
- Patent number 4,738,900
- Issue date Apr 19, 1988
- Hitachi, Ltd.
- Masahiro Ono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hybrid multilayer wiring board
- Patent number 4,710,854
- Issue date Dec 1, 1987
- Hitachi, Ltd.
- Minoru Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite of metal and resin having electrolytically reduced metal...
- Patent number 4,661,417
- Issue date Apr 28, 1987
- Hitachi, Ltd.
- Yoshihiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding copper and resin
- Patent number 4,642,161
- Issue date Feb 10, 1987
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless copper plating
- Patent number 4,632,852
- Issue date Dec 30, 1986
- Hitachi, Ltd.
- Haruo Akahoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, process for preparing the same and resist in...
- Patent number 4,610,910
- Issue date Sep 9, 1986
- Hitachi, Ltd.
- Mineo Kawamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermosetting resin composition from aromatic cyanamide
- Patent number 4,607,094
- Issue date Aug 19, 1986
- Hitachi, Ltd.
- Katuo Sugawara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacture of printed wiring board
- Patent number 4,604,160
- Issue date Aug 5, 1986
- Hitachi, Ltd.
- Kanji Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and laminate produced therefrom comprising a cycl...
- Patent number 4,587,162
- Issue date May 6, 1986
- Hitachi, Ltd.
- Akira Nagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Transparent resin material containing metallic atoms bonded to pend...
- Patent number 4,585,841
- Issue date Apr 29, 1986
- Hitachi, Ltd.
- Shuji Eguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition comprising (1) dicyanamide, (2) pol...
- Patent number 4,546,168
- Issue date Oct 8, 1985
- Hitachi, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer printed circuit board and process for production thereof
- Patent number 4,526,835
- Issue date Jul 2, 1985
- Hitachi, Ltd.
- Akio Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-resistant resin from aromatic cyanamide compound and aromatic...
- Patent number 4,486,583
- Issue date Dec 4, 1984
- Hitachi, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition comprising dicyanamide and polyvale...
- Patent number 4,482,703
- Issue date Nov 13, 1984
- Hitachi, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing printed circuit boards
- Patent number 4,457,952
- Issue date Jul 3, 1984
- Hitachi, Ltd.
- Mineo Kawamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition and prepolymer thereof
- Patent number 4,448,940
- Issue date May 15, 1984
- Hitachi, Ltd.
- Tohru Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing fire retardant and heat resistant copper-clad...
- Patent number 4,400,438
- Issue date Aug 23, 1983
- Hitachi Chemical Company, Ltd.
- Akio Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting prepolymer from polyfunctional maleimide and bis male...
- Patent number 4,393,188
- Issue date Jul 12, 1983
- Hitachi Chemical Company, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing printed circuit board by electroless plating
- Patent number 4,378,384
- Issue date Mar 29, 1983
- Hitachi, Ltd.
- Kanji Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imide prepolymer from reaction of epoxy compound with bis-imide/dia...
- Patent number 4,346,206
- Issue date Aug 24, 1982
- Hitachi Chemical Company, Ltd.
- Akio Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Motoyo Wajima

Person

Patents Grantslast 30 patents

Multi-layer wiring structure

Printed circuit board and method and apparatus for making same

Plastic optical fibers from polymers derived from metallic salts of...

Process for producing printed circuit board

Circuit board and process for producing the same

Thermosetting resin and prepreg and laminate using the same

Thermosetting resin and prepreg and laminate using the same

Photo-curable resist resin composition for electroless plating, pro...

Thermosetting resin composition and laminate and process for the pr...

Thermosetting resin composition and prepolymer obtained therefrom

Thermo-setting, polymerizable composition and wiring board

Hybrid multilayer wiring board

Composite of metal and resin having electrolytically reduced metal...

Method of bonding copper and resin

Process for electroless copper plating

Printed circuit board, process for preparing the same and resist in...

Thermosetting resin composition from aromatic cyanamide

Method for manufacture of printed wiring board

Resin composition and laminate produced therefrom comprising a cycl...

Transparent resin material containing metallic atoms bonded to pend...

Thermosetting resin composition comprising (1) dicyanamide, (2) pol...

Multi-layer printed circuit board and process for production thereof

Heat-resistant resin from aromatic cyanamide compound and aromatic...

Thermosetting resin composition comprising dicyanamide and polyvale...

Process for producing printed circuit boards

Thermosetting resin composition and prepolymer thereof

Process for producing fire retardant and heat resistant copper-clad...

Thermosetting prepolymer from polyfunctional maleimide and bis male...

Process for producing printed circuit board by electroless plating

Imide prepolymer from reaction of epoxy compound with bis-imide/dia...