Mow Huat GOH

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Johor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method for forming low-loop profiles
- Patent number 7,780,064
- Issue date Aug 24, 2010
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD FOR FORMING LOW-LOOP PROFILES
- Publication number 20070284416
- Publication date Dec 13, 2007
- Yam Mo WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR