MRUNAL A. KHADERBAD

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with conductive carbon layer and method for...
- Patent number 12,142,649
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Rong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for protecting low-k dielectric fe...
- Patent number 12,136,660
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene layer for low resistance contacts and damascene interconnects
- Patent number 12,136,570
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel structure
- Patent number 12,087,819
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures for stacked semiconductor devices
- Patent number 12,074,068
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including two-dimensional material and method...
- Patent number 12,040,328
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal budget dielectric for semiconductor devices
- Patent number 11,942,358
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance fill metal layer material as stressor in metal gates
- Patent number 11,923,367
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 11,854,871
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure formed by cyclic chemical vapor deposition
- Patent number 11,823,896
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,804,539
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing isolation layers in stacked transistor st...
- Patent number 11,798,985
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for stacked semiconductor devices
- Patent number 11,776,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 11,776,910
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs for semiconductor device
- Patent number 11,756,864
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective dual silicide formation using a maskless fabrication proc...
- Patent number 11,749,682
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal contact for semiconductor device
- Patent number 11,715,763
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,488,869
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel structure
- Patent number 11,476,333
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor device structure and method for forming...
- Patent number 11,476,365
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including two-dimensional material and method...
- Patent number 11,450,666
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance fill metal layer material as stressor in metal gates
- Patent number 11,404,416
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and via structures for semiconductor devices
- Patent number 11,380,781
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact interface engineering for reducing contact resistance
- Patent number 11,362,212
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making self-aligned barrier for metal vias In-Situ durin...
- Patent number 11,227,794
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gate dielectric and inhibitor film over...
- Patent number 11,211,465
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with metal containing layer
- Patent number 11,201,232
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 11,158,539
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION USING A MASKLESS FABRICATION PROC...
- Publication number 20240387291
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Mrunal A. KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER LAYER FOR BACKSIDE CONTACTS OF SEIMICONDUCTOR DEVICES
- Publication number 20240387653
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20240387645
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CHANNEL STRUCTURE
- Publication number 20240371939
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240363417
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD...
- Publication number 20240347540
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE FILL METAL LAYER MATERIAL AS STRESSOR IN METAL GATES
- Publication number 20240258318
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
- Publication number 20240170323
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
- Publication number 20240087952
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ISOLATION STRUCTURES
- Publication number 20230387254
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION LAYERS FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20230378257
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20230369335
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...
- Publication number 20230361042
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION USING A MASKLESS FABRICATION PROC...
- Publication number 20230361125
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Mrunal A. KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20230335592
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE CARBON LAYER AND METHOD FOR...
- Publication number 20230282715
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Rong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures for Stacked Semiconductor Devices
- Publication number 20230062940
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial Structures for Stacked Semiconductor Devices
- Publication number 20230068065
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE
- Publication number 20230030411
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER LAYER FOR BACKSIDE CONTACTS OF SEMICONDUCTOR DEVICES
- Publication number 20230015572
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD FOR PROTECTING LOW-K DIELECTRIC FE...
- Publication number 20230009745
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20230008496
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH CONDUCTIVE CARBON LAYERS
- Publication number 20230010280
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR ISOLATION STRUCTURES
- Publication number 20220384265
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance Fill Metal Layer Material as Stressor in Metal Gates
- Publication number 20220384439
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL AND METHO...
- Publication number 20220384441
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Channel Structure
- Publication number 20220359660
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS

MRUNAL A. KHADERBAD

Person

Patents Grantslast 30 patents

Semiconductor structure with conductive carbon layer and method for...

Semiconductor device, and method for protecting low-k dielectric fe...

Graphene layer for low resistance contacts and damascene interconnects

Dual channel structure

Epitaxial structures for stacked semiconductor devices

Method and structure for barrier-less plug

Semiconductor devices including two-dimensional material and method...

Self-aligned barrier for metal vias

Low thermal budget dielectric for semiconductor devices

Low resistance fill metal layer material as stressor in metal gates

Semiconductor structure with material modification and low resistan...

Conductive structure formed by cyclic chemical vapor deposition

Transistor isolation structures

Methods for manufacturing isolation layers in stacked transistor st...

Gate structures for stacked semiconductor devices

Partial barrier free vias for cobalt-based interconnects and method...

Contact plugs for semiconductor device

Selective dual silicide formation using a maskless fabrication proc...

Method of forming metal contact for semiconductor device

Transistor isolation structures

Dual channel structure

Fin field effect transistor device structure and method for forming...

Semiconductor devices including two-dimensional material and method...

Low resistance fill metal layer material as stressor in metal gates

Contact and via structures for semiconductor devices

Contact interface engineering for reducing contact resistance

Method for making self-aligned barrier for metal vias In-Situ durin...

Semiconductor device having gate dielectric and inhibitor film over...

Semiconductor structure with metal containing layer

Method and structure for barrier-less plug

Patents Applicationslast 30 patents

SELECTIVE DUAL SILICIDE FORMATION USING A MASKLESS FABRICATION PROC...

LINER LAYER FOR BACKSIDE CONTACTS OF SEIMICONDUCTOR DEVICES

CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES

DUAL CHANNEL STRUCTURE

EPITAXIAL STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SEMICONDUCTOR DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD...

LOW RESISTANCE FILL METAL LAYER MATERIAL AS STRESSOR IN METAL GATES

SELF-ALIGNED BARRIER FOR METAL VIAS

LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

TRANSISTOR ISOLATION STRUCTURES

ISOLATION LAYERS FOR STACKED TRANSISTOR STRUCTURES

GATE STRUCTURES FOR STACKED SEMICONDUCTOR DEVICES

Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...

SELECTIVE DUAL SILICIDE FORMATION USING A MASKLESS FABRICATION PROC...

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...

SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE CARBON LAYER AND METHOD FOR...

Gate Structures for Stacked Semiconductor Devices

Epitaxial Structures for Stacked Semiconductor Devices

FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE

LINER LAYER FOR BACKSIDE CONTACTS OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, AND METHOD FOR PROTECTING LOW-K DIELECTRIC FE...

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURES WITH CONDUCTIVE CARBON LAYERS

TRANSISTOR ISOLATION STRUCTURES

Low Resistance Fill Metal Layer Material as Stressor in Metal Gates

SEMICONDUCTOR DEVICES INCLUDING TWO-DIMENSIONAL MATERIAL AND METHO...

Dual Channel Structure