Mu-Han Cheng

Person

Tainan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 12,300,664
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,444
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Manikandan Arumugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 11,482,506
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, control method and apparatus for chemical mechanical polishing
- Patent number 10,792,783
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Chu Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Lens structure
- Patent number 10,050,159
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- G02 - OPTICS
Information Patent Grant
Image sensor manufacturing methods
- Patent number 9,721,984
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mu-Han Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for electrochemical deposition, conductive layer, and f...
- Patent number 7,837,841
- Issue date Nov 23, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258257
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING
- Publication number 20220336411
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220293541
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING
- Publication number 20210305205
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20190160625
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Chu Hu
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180166594
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Chen
- G02 - OPTICS
Information Patent Application
Image Sensor Manufacturing Methods
- Publication number 20130273686
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mu-Han Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR ELECTROCHEMICAL DEPOSITION, CONDUCTIVE LAYER, AND F...
- Publication number 20080223724
- Publication date Sep 18, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Kei-Wei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Mu-Han Cheng

Person

Patents Grantslast 30 patents

Edge-trimming methods for wafer bonding and dicing

Semiconductor structure and manufacturing method thereof

Edge-trimming methods for wafer bonding and dicing

Method for bonding wafers and bonding tool

System, control method and apparatus for chemical mechanical polishing

Lens structure

Image sensor manufacturing methods

Apparatuses for electrochemical deposition, conductive layer, and f...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING

SYSTEM, CONTROL METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING

METHOD FOR BONDING WAFERS AND BONDING TOOL

LENS STRUCTURE AND METHOD FOR FABRICATING THE SAME

Image Sensor Manufacturing Methods

APPARATUSES FOR ELECTROCHEMICAL DEPOSITION, CONDUCTIVE LAYER, AND F...