Muhammad Muhammat Sanusi

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Sungai Petani, MY

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Patents Grantslast 30 patents

Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an optical inspection feature
- Patent number 10,431,560
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing molded semiconductor packages having an opt...
- Patent number 9,806,043
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Leaded Semiconductor Package
- Publication number 20200343167
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Nurfarena Othman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Molded Semiconductor Package
- Publication number 20200006267
- Publication date Jan 2, 2020
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package Having an Optical Inspection Feature
- Publication number 20180033752
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Molded Semiconductor Packages Having an Opt...
- Publication number 20170256509
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS