Mukund Ayalasomayajula

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
THREE BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURES
- Publication number 20250106994
- Publication date Mar 27, 2025
- Intel Corporation
- Mukund AYALASOMAYAJULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
- Publication number 20250006691
- Publication date Jan 2, 2025
- Intel Corporation
- George Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
- Publication number 20230197659
- Publication date Jun 22, 2023
- Intel Corporation
- Mukund Ayalasomayajula
- H01 - BASIC ELECTRIC ELEMENTS