Mukund Kantilal Saraiya

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module with fluxless laser reflow soldered joints
- Patent number 5,852,257
- Issue date Dec 22, 1998
- International Business Machines Corporation
- Eberhard Siegfried Dittman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making an electrical interconnect structure
- Patent number 5,802,711
- Issue date Sep 8, 1998
- International Business Machines Corporation
- Duane Foster Card
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine for laser reflow soldering
- Patent number 5,763,854
- Issue date Jun 9, 1998
- International Business Machines Corporation
- Eberhard Siegfried Dittman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser reflow soldering process with lead-tin solder pads
- Patent number 5,742,025
- Issue date Apr 21, 1998
- International Business Machines Corporation
- Eberhard Siegfried Dittman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with tolerant wave soldered joints
- Patent number 5,663,526
- Issue date Sep 2, 1997
- International Business Machines Corporation
- Duane Foster Card
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with tolerant wave soldered joints
- Patent number 5,632,630
- Issue date May 27, 1997
- International Business Machines Corporation
- Duane F. Card
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with fluxless laser reflow soldered joints
- Patent number 5,604,831
- Issue date Feb 18, 1997
- International Business Machines Corporation
- Eberhard S. Dittman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with tolerant wave soldered joints
- Patent number 5,295,214
- Issue date Mar 15, 1994
- International Business Machines Corporation
- Duane F. Card
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic chip carrier with lead frame or edge clip
- Patent number 5,243,133
- Issue date Sep 7, 1993
- International Business Machines, Inc.
- Stephen R. Engle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste for use in a reducing atmosphere
- Patent number 4,919,729
- Issue date Apr 24, 1990
- International Business Machines Corporation
- Peter J. Elmgren
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Mukund Kantilal Saraiya

Person

Patents Grantslast 30 patents

Optical module with fluxless laser reflow soldered joints

Process for making an electrical interconnect structure

Machine for laser reflow soldering

Laser reflow soldering process with lead-tin solder pads

Optical module with tolerant wave soldered joints

Optical module with tolerant wave soldered joints

Optical module with fluxless laser reflow soldered joints

Optical module with tolerant wave soldered joints

Ceramic chip carrier with lead frame or edge clip

Solder paste for use in a reducing atmosphere