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Penang, MY
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last 30 patents
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Patent Grant
Capillary underfill and mold encapsulation method and apparatus
Patent number
7,262,077
Issue date
Aug 28, 2007
Intel Corporation
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
CAPILLARY UNDERFILL AND MOLD ENCAPSULATION METHOD AND APPARATUS
Publication number
20080017976
Publication date
Jan 24, 2008
Intel Corporation
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Capillary underfill and mold encapsulation method and apparatus
Publication number
20060214311
Publication date
Sep 28, 2006
Yin Men Lai
H01 - BASIC ELECTRIC ELEMENTS