Mun Seong Jeong

Person

  • Suwon-si, KR

Patents Grantslast 30 patents

  • Information Patent Grant

    Multilayer electronic component

    • Patent number 11,854,744
    • Issue date Dec 26, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jinkyung Park
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240203644
    • Publication date Jun 20, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Gil Yong LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240161981
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Mun Seong JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240161978
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyun Jun HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240062962
    • Publication date Feb 22, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jinkyung Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20220189692
    • Publication date Jun 16, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Jinkyung Park
    • H01 - BASIC ELECTRIC ELEMENTS